Industry News

Mark LaPedus of Semiconductor Engineering published an interesting discussion about the push for smaller and smaller ICs, driven mostly by the mobile device market.  Read his article here.

Semiconductor Engineering on June 26 published two articles about exciting (if unsettling) shake-ups in our industry:

Ed Sperling says too many choices and uncertainty turn new chip architectures into riskier gambles—and force a rethinking of what’s next.  Read here.

Brian Bailey says industry is mixed over … [Read More]

Experts See Tougher Memory Choices
An interesting discussion in Semiconductor Engineering highlights the importance of choosing the right memory – and the right memory vendor.  Brian Bailey reported on June 12 from DAC, where the conversation included Herbert Gebhart (Rambus), Bernard Murphy (Atrenta), Patrick Soheili (IP Solutions and eSilicon), and John … [Read More]

Ziptronix and EVG have announced a new milestone in wafer-to-wafer alignment. This is great news for the 3D-IC industry – and also for Tezzaron, as we work very closely with both organizations.

Francoise von Trapp discusses the achievement at some length in a [Read More]