Sub-Micron Wafer-to-Wafer Alignment Jun16 By Webmaster • Posted in Industry News June 16, 2014 Ziptronix and EVG have announced a new milestone in wafer-to-wafer alignment. This is great news for the 3D-IC industry – and also for Tezzaron, as we work very closely with both organizations. Francoise von Trapp discusses the achievement at some length in a 3D InCites article.