Permanent Wafer Bonding Jul28 By Webmaster • Posted in Industry News July 28, 2014 There are many ways to stick two wafers together. Tezzaron uses two permanent bonding methods: copper thermo-compression and copper/oxide “hybrid” – the latter developed by Ziptronix and licensed to us. Hybrid bonding gets a vote of confidence in Amandine Pizzagalli’s recent summary (in 3D InCites): [Read More]
Network-on-Chip Jul25 By Webmaster • Posted in Industry News July 25, 2014 Let others argue about the demise of Moore’s Law. (Next year? Yesterday?) K. Charles Janac defines a solid pathway to future electronics in his EE Times piece: “Life After 28nm: Think Network-on-Chip”
Next-Generation Fusion Wafer Bonding Jul14 By Webmaster • Posted in Industry News July 14, 2014 Tezzaron’s thermal diffusion bonding relies on equipment from EVG. Their new advance in alignment accuracy is terrific news! Read the article in Solid State Technology: “EVG clears key barriers”
Economic realities of 3D Jul10 By Webmaster • Posted in Industry News July 10, 2014 Economics create a mandate for vertical packaging according to Ed Sperling of Semiconductor Engineering. Read his article here.
Courage! Jul8 By Webmaster • Posted in Industry News July 8, 2014 Francoise von Trapp – “The Queen of 3D” – wonders why more companies aren’t designing 3D chips with through-silicon interconnect. Her conclusion: “it all comes down to courage. We’ll see who has it and who doesn’t”! Read her article … [Read More]