Bob Patti, Tezzaron Semiconductor, at the RTI 3D Architectures for Semiconductor Integration and Packaging 2011 Dec20 By Webmaster • Posted in Tezzaron in the News December 20, 2011 Bob Patti, CTO, Tezzaron Semiconductor, talks about the challenges and opportunities 3D integration brings to the semiconductor manufacturing industry, and Tezzaron’s role in bringing 3D IC integration to market… watch video