Advanced Packaging Alphabet Soup Creates Chaos for IMAPS 3D Panel Mar18 By Webmaster • Posted in Tezzaron in the News March 18, 2014 All hell broke loose at the 3D Panel discussion at the 2014 IMAPS International Device Packaging Conference. Nobody was hurt, and nothing got thrown, mind you, but it’s clear that we’ve got some very different opinions regarding one of my pet peeves – the ever-expanding and increasingly complex advanced packaging nomenclature…read more on 3D InCities