The Intimate Memory Interconnect Standard (IMIS) being promoted by the 3D-IC Alliance recently released its official specification for 3-D stacking memory chips…read more on EEtimes
3-D Chip Stacks Standardized
July 10, 2008
The Intimate Memory Interconnect Standard (IMIS) being promoted by the 3D-IC Alliance recently released its official specification for 3-D stacking memory chips…read more on EEtimes