Tezzaron Touted at AIDA Apr8 By Webmaster • Posted in Tezzaron Presents April 8, 2013 Tezzaron is represented at “AIDA – Academia meets Industry” in Italy with a presentation: “Implementing 2.5D and 3D Devices”
INFIERI 2013 Feb27 By Webmaster • Posted in Tezzaron Presents February 27, 2013 Tezzaron participates in the inaugural meeting of the international INFIERI project in Paris and presents “3D Technology: Where do we stand?”
Novati Announces Licensing Agreement Jan16 By Webmaster • Posted in Industry News January 16, 2013 Novati (Tezzaron’s Austin fab) announces a licensing agreement with Ziptronix.
Novati Technologies Licenses Ziptronix’s Direct Oxide Bonding (ZiBond®) and Direct Bond Interconnect (DBI®) Patented Technologies For Advanced 3D Integrated Assemblies Jan16 By Webmaster • Posted in Press Releases January 16, 2013 RESEARCH TRIANGLE PARK, N.C. – Jan. 16, 2013 Ziptronix, Inc. has signed a licensing agreement with Novati Technologies, Inc. for the use of its patents covering direct bonding technology, ZiBond® and DBI®. “We believe that Ziptronix’s patented direct bonding technology enables the industry’s best performance for applications such as 3D memory, BSI … [Read More]
2.5D Through-Silicon Interposer Consortium at IME Jan1 By Webmaster • Posted in Tezzaron Presents January 1, 2013 Tezzaron participates in the launch of the new 2.5D Through-Silicon Interposer Consortium at the Institute of Microelectronics (IME) in Singapore.