Novati in the Press Jul1 By Webmaster • Posted in Press Releases July 1, 2013 Novati (our fab in Austin) gets great press: “Novati takes old chip assets to build a new kind of fab” (GigaOm) and “Novati Covers the Periodic Table” (SemiWiki) and “Novati Technologies Launches Nanofabrication Center with World’s Largest Portfolio of Product Development Materials” (BusinessWire)
ConFab 2013 Jun25 By Webmaster • Posted in Tezzaron Presents June 25, 2013 Tezzaron presents “Why 2.5D and 3D Semiconductors Are Changing Everything” at ConFab 2013 in Las Vegas, NV
DAC 2013 Jun6 By Webmaster • Posted in Tezzaron Presents June 6, 2013 Tezzaron presents “Where Are All of Those 3D Chips?” at a special session in DAC 2013 in Austin, TX
Mentor and Tezzaron Optimize Calibre 3DSTACK for 2.5/3D-ICs May20 By Webmaster • Posted in Press Releases May 20, 2013 WILSONVILLE, Ore., May 20, 2013 Mentor Graphics Corp. (NASDAQ: MENT) and Tezzaron Semiconductor Corp. today announced they are collaborating to integrate the Mentor® Calibre® 3DSTACK product into Tezzaron’s 3D-IC offerings. The new integration will focus on fast, automated verification of die-to-die interactions in 2.5D and 3D stacked die configurations by verifying … [Read More]
Fabricating 2.5D, 3D, 5.5D Devices Apr15 By Webmaster • Posted in Tezzaron Presents April 15, 2013 Tezzaron presents “Fabricating 2.5D, 3D, 5.5D Devices” to the Global Semiconductor Alliance