Global Foundries 3D Progress (EE Times) Mar19 By Webmaster • Posted in Industry News March 19, 2014 GloFo Shows Progress in 3D Stacks (EE Times)
Advanced Packaging Alphabet Soup Creates Chaos for IMAPS 3D Panel Mar18 By Webmaster • Posted in Tezzaron in the News March 18, 2014 All hell broke loose at the 3D Panel discussion at the 2014 IMAPS International Device Packaging Conference. Nobody was hurt, and nothing got thrown, mind you, but it’s clear that we’ve got some very different opinions regarding one of my pet peeves – the ever-expanding and increasingly complex advanced … [Read More]
Tezzaron’s 3D Chips at the Instrumentation Frontier Mar11 By Webmaster • Posted in Tezzaron in the News March 11, 2014 “Fermilab organized an international consortium of a dozen physics laboratories to produce a demonstration 3D pixel-readout chip. They chose Tezzaron Semiconductor, a leader in the 3D field, as an industrial partner … Together, the laboratory consortium overcame design and manufacturing challenges to develop a highly successful 3D chip.” [Read More]
Tezzaron at the Instrumentation Frontier Mar11 By Webmaster • Posted in Tezzaron in the News March 11, 2014 3D pixel-readout chip, designed by Fermilab consortium, built by Tezzaron “…Fermilab organized an international consortium of a dozen physics laboratories to produce a demonstration 3D pixel-readout chip. They chose Tezzaron Semiconductor, a leader in the 3D field, as an industrial partner…” Read the article in … [Read More]
INFIERI in Madrid Jan21 By Webmaster • Posted in Tezzaron Presents January 21, 2014 Tezzaron presents “New Developments from Tezzaron” and “3D Vertical Interconnect Software Kits” at the INFIERI Workshop in Madrid: “Intelligent Front-End Signal Processing for Frontier Exploitation in Research and Industry