Tezzaron Builds 3D Sensors for Fermilab Apr9 By Webmaster • Posted in Tezzaron in the News April 9, 2014 “Each of the integrated circuits you see here is about 6 millimeters on a side and projects one one-thousandth of an inch above the surface of the larger sensor wafer on which it sits … Fermilab is behind the novel concept of the detector devices and design, which are known … [Read More]
3D transistors, 3D chips, and 2.5D Apr9 By Webmaster • Posted in Tezzaron in the News April 9, 2014 “From the ultra-small 3D transistors described in papers at this month’s International Electron Devices Meeting (IEDM) in Washington, D.C., to the 2.5D and 3D multichip structures described at the 3D Architectures for Semiconductor Integration and Packaging (ASIP) conference held in Burlingame, Calif., designers are finding more ways to pack more … [Read More]
Novati’s David Anderson named the “Innovator of the Year” Apr7 By Webmaster • Posted in Industry News April 7, 2014 “The Austin-based executive received the Annual Creativity in Electronics award, presented April 1 by the semiconductor technology media … The award was based on the leadership, creativity and out-of-the-box thinking…” read the article in the Austin Business Journal
Tezzaron CTO Bob Patti at IMAPS Mar31 By Webmaster • Posted in Tezzaron in the News March 31, 2014 “The annual IMAPS Device Packaging Conference in Ft. McDowell, AZ is always a source for the latest packaging information … Bob Patti addressed the interposer cost issue head on during a panel session” read the article in Solid State Technology
News Items: March 2014 Mar31 By Webmaster • Posted in Tezzaron in the News March 31, 2014 In addition to other posts, Tezzaron is mentioned in two industry publications this month: GloFo Shows Progress in 3D Stacks (EE Times) IFTLE 183 RTI ASIP: Tezzaron… (Insights from the Leading Edge)