ConFab 2013 Jun25 By Webmaster • Posted in Tezzaron Presents June 25, 2013 Tezzaron presents “Why 2.5D and 3D Semiconductors Are Changing Everything” at ConFab 2013 in Las Vegas, NV
DAC 2013 Jun6 By Webmaster • Posted in Tezzaron Presents June 6, 2013 Tezzaron presents “Where Are All of Those 3D Chips?” at a special session in DAC 2013 in Austin, TX
Fabricating 2.5D, 3D, 5.5D Devices Apr15 By Webmaster • Posted in Tezzaron Presents April 15, 2013 Tezzaron presents “Fabricating 2.5D, 3D, 5.5D Devices” to the Global Semiconductor Alliance
Tezzaron Touted at AIDA Apr8 By Webmaster • Posted in Tezzaron Presents April 8, 2013 Tezzaron is represented at “AIDA – Academia meets Industry” in Italy with a presentation: “Implementing 2.5D and 3D Devices”
INFIERI 2013 Feb27 By Webmaster • Posted in Tezzaron Presents February 27, 2013 Tezzaron participates in the inaugural meeting of the international INFIERI project in Paris and presents “3D Technology: Where do we stand?”