Mentor and Tezzaron Optimize Calibre 3DSTACK for 2.5/3D-ICs May20 By Webmaster • Posted in Press Releases May 20, 2013 WILSONVILLE, Ore., May 20, 2013 Mentor Graphics Corp. (NASDAQ: MENT) and Tezzaron Semiconductor Corp. today announced they are collaborating to integrate the Mentor® Calibre® 3DSTACK product into Tezzaron’s 3D-IC offerings. The new integration will focus on fast, automated verification of die-to-die interactions in 2.5D and 3D stacked die configurations by verifying … [Read More]
Novati Technologies Licenses Ziptronix’s Direct Oxide Bonding (ZiBond®) and Direct Bond Interconnect (DBI®) Patented Technologies For Advanced 3D Integrated Assemblies Jan16 By Webmaster • Posted in Press Releases January 16, 2013 RESEARCH TRIANGLE PARK, N.C. – Jan. 16, 2013 Ziptronix, Inc. has signed a licensing agreement with Novati Technologies, Inc. for the use of its patents covering direct bonding technology, ZiBond® and DBI®. “We believe that Ziptronix’s patented direct bonding technology enables the industry’s best performance for applications such as 3D memory, BSI … [Read More]
Ziptronix Licenses DBI® and ZiBond® to Tezzaron Dec12 By Webmaster • Posted in Press Releases December 12, 2012 Ziptronix Licenses Direct Bond Interconnect (DBI®) and ZiBond® Patented Technologies to Tezzaron Semiconductor for Advanced 3D Memory and 3D Integrated Assemblies RESEARCH TRIANGLE PARK, N.C., December 12, 2012 Ziptronix, Inc. has signed a licensing agreement with Tezzaron Semiconductor for the use of patents regarding Ziptronix’s direct bonding technologies, ZiBond™ and DBI®. “There is … [Read More]
Tezzaron Semiconductor Completes Acquisition of SVTC’s Austin Fab, Now Novati Technologies Oct22 By Webmaster • Posted in Press Releases October 22, 2012 Naperville, IL and Austin, TX (22 October, 2012) Tezzaron Semiconductor’s acquisition of the former SVTC facility in Austin is complete. The fab now operates as a newly formed Texas corporation, “Novati Technologies, Inc.,” with Tezzaron as the sole shareholder of the corporation. The deal closed on Monday, Oct. 15, 2012. The acquisition … [Read More]
Tezzaron Acquires Texas Semiconductor Facility Oct1 By Webmaster • Posted in Press Releases October 1, 2012 Naperville, IL – October 1, 2012 Tezzaron Semiconductor has signed a contract to purchase the assets of a semiconductor technology development and wafer fabrication facility in Austin, Texas, previously run by SVTC Technologies. Tezzaron will continue the operations of this unique facility while adding capabilities to assemble its own revolutionary three … [Read More]