Tezzaron in the News

3D transistors, 3D chips, and 2.5D

“From the ultra-small 3D transistors described in papers at this month’s International Electron Devices Meeting (IEDM) in Washington, D.C., to the 2.5D and 3D multichip structures described at the 3D Architectures for Semiconductor Integration and Packaging (ASIP) conference held in Burlingame, Calif., designers are finding more ways to pack more … [Read More]

Tezzaron’s 3D Chips at the Instrumentation Frontier

“Fermilab organized an international consortium of a dozen physics laboratories to produce a demonstration 3D pixel-readout chip. They chose Tezzaron Semiconductor, a leader in the 3D field, as an industrial partner … Together, the laboratory consortium overcame design and manufacturing challenges to develop a highly successful 3D chip.” [Read More]