Ziptronix Licenses DBI® and ZiBond® to Tezzaron Dec12 By Webmaster • Posted in Press Releases December 12, 2012 Ziptronix Licenses Direct Bond Interconnect (DBI®) and ZiBond® Patented Technologies to Tezzaron Semiconductor for Advanced 3D Memory and 3D Integrated Assemblies RESEARCH TRIANGLE PARK, N.C., December 12, 2012 Ziptronix, Inc. has signed a licensing agreement with Tezzaron Semiconductor for the use of patents regarding Ziptronix’s direct bonding technologies, ZiBond™ and DBI®. “There is … [Read More]
Tezzaron Semiconductor Completes Acquisition of SVTC’s Austin Fab, Now Novati Technologies Oct22 By Webmaster • Posted in Press Releases October 22, 2012 Naperville, IL and Austin, TX (22 October, 2012) Tezzaron Semiconductor’s acquisition of the former SVTC facility in Austin is complete. The fab now operates as a newly formed Texas corporation, “Novati Technologies, Inc.,” with Tezzaron as the sole shareholder of the corporation. The deal closed on Monday, Oct. 15, 2012. The acquisition … [Read More]
Tezzaron Acquires Texas Semiconductor Facility Oct1 By Webmaster • Posted in Press Releases October 1, 2012 Naperville, IL – October 1, 2012 Tezzaron Semiconductor has signed a contract to purchase the assets of a semiconductor technology development and wafer fabrication facility in Austin, Texas, previously run by SVTC Technologies. Tezzaron will continue the operations of this unique facility while adding capabilities to assemble its own revolutionary three … [Read More]
Want some real-world insight into 2.5D and 3D IC design and assembly? Read on to get the word from Tezzaron Semiconductor Jul12 By Webmaster • Posted in Tezzaron in the News July 12, 2012 Ann Steffora-Mutschler just published an interview with Robert Patti, chief technology officer at Tezzaron Semiconductor, that gives some terrific technical detail about 2.5D and 3D IC design and assembly. Patti provides some rare insight into today’s (as in right now) 2.5D/3D state of the art through some really interesting qualitative … [Read More]
Tezzaron in the News: 2011 Dec31 By Webmaster • Posted in Tezzaron in the News December 31, 2011 December 2011: Honeywell, Tezzaron Semi partner to develop 3D chips for military/aero applications (Smart Brief) December 2011: Rad-hard 3D integrated circuit design for aerospace and defense is goal of Honeywell-Tezzaron partnership (Military & Aerospace Electronics) December 2011: Honeywell taps Tezzaron Semiconductor to stack rad-hard die (ElectroIQ) December 2011: Honeywell … [Read More]