Tezzaron in the News

Ziptronix Licenses DBI® and ZiBond® to Tezzaron

Ziptronix Licenses Direct Bond Interconnect (DBI®) and ZiBond® Patented Technologies to Tezzaron Semiconductor for Advanced 3D Memory and 3D Integrated Assemblies

RESEARCH TRIANGLE PARK, N.C., December 12, 2012

Ziptronix, Inc. has signed a licensing agreement with Tezzaron Semiconductor for the use of patents regarding Ziptronix’s direct bonding technologies, ZiBond™ and DBI®.

“There is … [Read More]

Tezzaron Semiconductor Completes Acquisition of SVTC’s Austin Fab, Now Novati Technologies

Naperville, IL and Austin, TX (22 October, 2012)

Tezzaron Semiconductor’s acquisition of the former SVTC facility in Austin is complete. The fab now operates as a newly formed Texas corporation, “Novati Technologies, Inc.,” with Tezzaron as the sole shareholder of the corporation. The deal closed on Monday, Oct. 15, 2012.

The acquisition … [Read More]

Tezzaron Acquires Texas Semiconductor Facility

Naperville, IL – October 1, 2012

Tezzaron Semiconductor has signed a contract to purchase the assets of a semiconductor technology development and wafer fabrication facility in Austin, Texas, previously run by SVTC Technologies. Tezzaron will continue the operations of this unique facility while adding capabilities to assemble its own revolutionary three … [Read More]

Want some real-world insight into 2.5D and 3D IC design and assembly? Read on to get the word from Tezzaron Semiconductor

Ann Steffora-Mutschler just published an interview with Robert Patti, chief technology officer at Tezzaron Semiconductor, that gives some terrific technical detail about 2.5D and 3D IC design and assembly. Patti provides some rare insight into today’s (as in right now) 2.5D/3D state of the art through some really interesting qualitative … [Read More]