Stacked dies – a good discussion Aug7 By Webmaster • Posted in Industry News August 7, 2014 3D and 2.5D are “inevitable” according to Brian Bailey (in Semiconductor Engineering), but he wonders about the cost. His thoughtful article makes good reading. [See it here]
3DIC Business Update Aug4 By Webmaster • Posted in Industry News August 4, 2014 A report from Research and Markets highlights the bright future of 3D and 2.5D.
Advances in Fusion Bonding Jul31 By Webmaster • Posted in Industry News July 31, 2014 Austria’s EV Group (EVG) supplies the excellent equipment Tezzaron uses for copper thermal diffusion bonding. Solid State Technology has published a story about their latest achievements: “Fusion bonding for next-generation 3D-ICs”
Are we “real”? Jul30 By Webmaster • Posted in Industry News July 30, 2014 Yes, Tezzaron is real! In a thoughtful “3D InCites” post, Francoise von Trapp says that 3D products in small niche markets are just as “real” as in high-volume manufacturing. (And industry spokespersons can’t agree on the definition of “high-volume” anyway.) You can read her entire article [Read More]
3D and the “Internet of Things” Jul29 By Webmaster • Posted in Industry News July 29, 2014 “IoT” is the hot new buzzword. How does 3D/2.5D fit into this paradigm? Herb Reiter makes some very good points in his 3D InCites article: …One Plus One is More Than Two