The Tezzblog

Tezzaron at the Electronics Packaging Symposium

The 2014 Electronics Packaging Symposium was held Oct 8-9 at IEEC, Binghamton University, in New York. This year’s event covered several small-scale technologies, including 3D and 2.5D, and featured a 2.5D & 3D Packaging Workshop.

Bob Patti of Tezzaron presented 2.5/3D Integration Technology and Applications.