Tezzaron Announces World’s First Eight-Layer Active Wafer Stack Aug31 By Webmaster • Posted in Press Releases August 31, 2015 Tezzaron and Novati announce an 8-layer wafer stack containing high-performance CMOS logic — the most wafers ever assembled in such a stack! There are no wire bonds, copper pillars, bumps, or underfill between the layers, just ultra-thin wafers with circuitry, connected vertically with tiny tungsten SuperContacts™. This is the densest 3D-IC ever reported! Read the press release here.