The Tezzblog

Tezzaron Announces World’s First Eight-Layer Active Wafer Stack

Tezzaron and Novati announce an 8-layer wafer stack containing high-performance CMOS logic — the most wafers ever assembled in such a stack!  There are no wire bonds, copper pillars, bumps, or underfill between the layers, just ultra-thin wafers with circuitry, connected vertically with tiny tungsten SuperContacts™.  This is the densest 3D-IC ever reported!  Read the press release here.