“Martin” 3D MPW Project

The “Martin” multi-project wafer — Tezzaron co-designed and built 3D-IC prototype devices in collaboration with 20 participants. Some devices were built as two-layer chips, others were integrated with 3D memory chips to create multi-layer 3D-ICs.

More photos will be added to this page as they become available.

[ngg_images gallery_ids=”7″ display_type=”photocrati-nextgen_basic_imagebrowser”]