“Martin” 3D MPW Project

The “Martin” multi-project wafer — Tezzaron co-designed and built 3D-IC prototype devices in collaboration with 20 participants. Some devices were built as two-layer chips, others were integrated with 3D memory chips to create multi-layer 3D-ICs.

More photos will be added to this page as they become available.

"Martin" 3D MPW Project

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This is a finished 2-wafer stack with aluminum back metal, ready for dicing.