The Tezzblog

Robert Patti

Previous experience: Founder and President of the predecessor company, ASIC Designs, Inc.; Member of Technical Staff for Tellabs, Inc. Member of IEEE. Former Vice-Chairman of JEDEC’s DDRIII / Future Memories Task Group. Holder of 18 US patents, numerous foreign patents and many more pending patent applications in deep sub-micron semiconductor chip technologies; BS (EE/CS) and BS (Physics), Rose-Hulman Institute of Technology.

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