Interconnected Wafer Stack

Both micrographs show a cross-section of a three-wafer stack connected with copper Super-Vias. In both photos, the bottom wafer is face up, with silicon on the bottom and copper bondpoints on the top; the upper two wafers are face down (silicon on the top).

[ngg_images gallery_ids=”6″ display_type=”photocrati-nextgen_basic_imagebrowser”]