3D TSV Packages Market Growth Jan31 By Webmaster • Posted in Tezzaron in the News January 31, 2017 Future Market Insights lists Tezzaron as a “leading player of this industry” in their report, 3D TSV Packages Market Growth, Forecast and Value Chain 2016-2026 More from their press release: Currently, 3D Packaging using Through Silicon Via technology (3D TSV) is one of the hottest topics in the semiconductor ecosystem. … Growing demand for innovative chip architectures with improved features such as low power consumption, high aspect ratio, and smaller form factor is driving the market of 3D TSV packages. Additionally, factors such as proliferation in the cloud based applications, robust outlook for the Information & Communication Technologies segment, and persistent developments in the DRAM and smart lighting sectors are further cementing the adoption of 3D TSV packages for fabrication process. The market is expected to witness potential revenue opportunity mainly due to growth in its application areas such as MEMS, CMOS image sensors, optoelectronics and high end LED solutions.