3D Sensor Demo/Test

This fully functional 3D-IC was manufactured as part of Tezzaron’s “Orion” project in 2004.  It is a prototype image sensor built in two layers that were manufactured on two separate wafers.

3D Sensor, Layer 1

Picture 1 of 4

The first layer contains the sensor arrays, which are illuminated from the back. There are six different arrays, each with a different type of sensor cell. The two largest arrays each have over 9000 cells; these arrays are visible as the blue and yellow rectangles in this picture. The other four arrays are very small, and not easily distinguished here.