High performance more-than-Moore transistor-level 3D technology that utilizes wafer bonding, proprietary SuperContacts®, dis-integrated architectures, and BiSTAR® programmable self-test.
In 2004 Tezzaron demonstrated the world's first successful wafer-stacked 3D-ICs with through-silicon interconnect, including microprocessors, sensors, and SRAM devices. Since that time the company has worked with dozens of customers to create custom 3D-ICs for prototyping and commercialization.
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Tezzaron's Di3D technology allows high transistor density and wicked-fast on-die communication in a small footprint.