Our 3D-ICs are stacked at wafer level, each layer thinned to as little as 10 microns, and vertically interconnected with tungsten — as many as one million vertical contacts per square millimeter.
These incredibly fine vertical connections are applied by the hundreds of thousands, allowing a single circuit to be spread vertically across multiple dies. They are so small we don’t even call them TSVs. They are SuperContacts™!
Disparate circuit elements call for divergent wafer processes. Tezzaron’s FaStack® technology and SuperContacts™ can handle that. We “dis-integrate” a circuit onto separate wafers, each built in a process exactly suited to its elements. Memory storage elements (bit cells) are built with very low leakage, or specialized gates, or even ferromagnetic properties. Sense amps, write drivers, etc. get a high speed logic process. The result? A true win-win, both faster and more reliable than conventional devices. But memory is just the low-hanging fruit. Dis-integration is the real key to high performance ICs of all types.
Our unique on-chip Bi-STAR® system performs at-speed testing at the factory. But that’s just the beginning. Bi-STAR® continuously performs ECC, re-tests the device, and even repairs it while installed in an operating system. For data integrity, there has never been anything like it.
Tezzaron has patented more critical IP, developed more know-how, and delivered more 3D products than any other supplier. We have delivered scores of finished 3D-IC designs to dozens of customers in the commercial, government, and academic sectors. If you are looking for success in 3D, you have come to the right place.