About the Company:
Tezzaron® Semiconductor specializes in cutting-edge
memory products, 3D wafer stacking and TSV
processes, and other innovations. Tezzaron's goal is to propel the semiconductor industry
toward ever higher performance and greater profitability. The company has produced
extremely fast memory prototypes and is now building
SRAM replacement parts and 3D
stacked DRAMs. In 2004 Tezzaron demonstrated the world's first successful wafer-stacked 3D-ICs
with TSV, including microprocessors,
sensors, and SRAM devices.
Since that time the company has worked with dozens of customers to create custom
3D-ICs for prototyping and commercialization.
In the near term, Tezzaron will:
 |
Continue
to spearhead the industry's move to 3D integrated circuits with our
FaStack® technology, integrating elements
vertically into fast, dense, low-power one-chip solutions.
|
|
Offer high-end memory chips with
3D-IC architectures and our blazingly fast
3T-iRAM®, out-performing all other
memory technologies.
|
|
Bring
innovative products and technology to market, creating and patenting ways to
improve the speed, density, and reliability of electronic devices.
|
We invite you to explore our company by using the buttons and links at left and right.
|
More about the company:
|
