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| Newspaper and industry articles on Tezzaron® (and/or
Tachyon) are listed in reverse chronological order: |
| Date |
Headline |
| 27 Dec. '04 |
"3D Chips: Pro and Con"
(Rostov, in Russian), picked up by Russian publications besm-2000,
iXBT, Aspark, 7Wolf,
UA-sIT |
| 23 Dec. '04 |
Press release:
3D Semiconductors Poised for Revolution;
published by
Silicon
Strategies as "Six 3D designs precede 90% power-saving claims from
Tezzaron"; picked up by
Wall Street
& Technology, Electronic Business Asia,
Automotive
Design Line,
EE Times China,
51 Project (China),
Science News |
| 22 Dec. '04 |
RF applications will
follow the 3D Interconnect path... (RFDesign), referenced by Defense Electronics |
| 20 Dec. '04 |
The
ups and downs of three-dimensional circuits (Silicon Strategies) --
Identified as one of their
Top Ten Stories of 2004; picked up by
Bank Systems & Technology,
Wall Street & Technology, Silicon IP Exchange (Hong Kong), Traders' Corner (Norway), and by Chinese publications ESM
China, c|net,
CSIP,
Lodestar, computer.online, etime, China Electronic Material |
| 6 Dec. '04 |
Press Release:
Speedy Processor Has Memory "Upstairs" (for
general press) and
Press Release: Third Dimension Triples
Processor Speed (for technical publications); published by
Silicon Strategies (EE
Times) as "Tezzaron debuts 'super-8051' chip with 3D technology"; picked up
by FSA,
Wall Street & Technology,
Bank Systems &
Technology, Elektronik i Norden,
EE Times Taiwan, and by
Chinese publications etime,
51 Project, IEE China,
Electronic World,
CSIP,
EE Times China,
embed-mcu |
| 30 Nov. 04 |
High-rise
circuitry lures chip makers (EE Times) Picked up by Silicon Strategies,
EE Times Taiwan,
Memory Digest, NewsTrove, Silicon IP Exchange, and by Chinese publications
EE Times China,
CSIA, CSIP, etime, China IC net |
| 29 Nov. '04 |
3D Interconnect Gets Real (Wafer News and Solid State Technology) |
| 22 Nov. '04 |
Press Release: Tezzaron
Launches RAM in a New Dimension, picked up by Semiconductor Reporter. |
| 19 Nov. '04 |
MagnaChip, Tezzaron form
partnership for 3D chips (Silicon Strategies/EE Times), picked up by
Silicon
Strategies Newsletter, Legit
Reviews, DigiTimes,
Science News,
Packaging Today, SemiAcademy (Korea), phoenixJP.News (France), Lodestar (China), CSIP (China),
CSIA (China), CNe Buyer (China), CVIA (China), Stor-Age,
EE Times China,
EE Times Taiwan
(logins required for EE Times). |
| 10 May '04 |
Press Release:
Tezzaron Wins $1M in Purchase Orders |
| 26 April '04 |
Tech firm's stacked chips zip to market (Crain's Chicago Business -
login required) |
| 15 April '04 |
3D Interconnect
Technology Coming to Light (Electronic News) Six paragraphs about Tezzaron
are under the subheading "Starting Up on the 3D Frontier"
picked up by ACM
news service, EinNews
(Germany), Australian Microelectronics Network |
| 14 April '04 |
Press Release: Tezzaron
Announces Commercial 3D ICs
picked up by
Silicon
Strategies, SemiAcademy, Daily Herald |
| November '03 |
Semiconductor Investment
and the Future (Gilder Technology Report) Tezzaron receives favorable notice
under "Consequences" near the bottom of page 3. |
| November '03 |
New Memory Technology Promises Top Speeds
(Electronic Products) |
| Sept. '03 |
Wafers Stack on
Copper Super-Vias (SolidState Technology)
(Headline and story are about half-way down the page) |
| 28 August '03 |
Tezzaron delivers
challenge to SRAM, DRAM (EBN)
picked up by Electronics
Supply & Manufacturing |
| 25 August '03 |
Tezzaron Prototypes Pseudostatic
Memory (EE Times)
picked up by EET
Asia, physics.surfwax.com |
| 18 August '03 |
Press Release: New
Memory Technology is World's Fastest, picked up by
Silicon
Strategies,
EE Times,
EETimes IP/SoC Newsletter,
Design and Reuse, TechNewsWorld,
EE Design, CommsDesign,
The Work Circuit, Today's Science News, EE Times UK, EE Times Taiwan; Finland:
Prosessori; Belarus:
KB Online, "Zhelezniy";
China: CCW, China Semiconductor Industry Association, Electron.Cetin, ETIRI, EE Times China; Russia:
Compulenta,
Computerra, Inforser,
Ak-Cent Microsystems,
DELFI,
Alta Plus,
Business
Online, Saturn-Plus,
Roscomputer, XXP-Design,
Crosna Space Communications, Caspian World News, Talk.Mail/Forum,
ITInfo, PCSamara, IVEN Computers,
RussianPhiladelphia,
F-Center, PCHard, HomePC, Ferra,
iBusiness, Rostov, CPrice Info, EZPC, TechnoStyle,
ProComputer Hotline,
GoldSoft, Computer News, ArtCom, XKP;
Ukraine: Alser MyComp, Gazeta 2000, Corason, Allintel; Latvia:
digital times,
AK-Cents Microsystems; Korea: EE Times Korea, iCON, ECRC, ICAT; Lithuania:
Takas;
Kazakhstan: Computers; Moldova: NewsGate; Germany: FinanzNachrichten; and
others. |
| 24 July '03 |
Press Release: Tezzaron
Moves to Provide 3-D Chips, Stacks, Services |
| 29 June '03 |
Press Release:
Another Giant Step Toward 3-D Silicon, picked up by
Silicon Strategies,
EE Times, Science News, China
Semiconductor Industry Association, CCW (China),
EE Times China (requires
login),
EE Times Korea
(requires login),
EE Times Taiwan
(requires login), FEDOnline (Japan),
Hardburg (Russia), F-Center (Russia),
Inovacao
Tecnologica (Brazil) |
| 7 Feb. '03 |
Press Release: 3-D
Stacking Reaches New Heights, picked up by
Design And Reuse,
Silicon Strategies,
CommsDesign,
EE Times,
EE Times UK,
Electronics
Times |
Other articles:
Copyright © 2003-2009 Tezzaron® Semiconductor. All rights reserved.
Revised: July 21, 2010
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