3D-IC Microprocessor Prototype:
This
two-layer 3D- IC with vertical interconnections was built using Tezzaron's FaStack™ process.
One layer of the chip contains an 8051-style
processor, the other contains SRAM memory. The chip used here was
built in 2004.
Demo Setup:
The demonstration device contains the Tezzaron 3D-IC prototype and another fast 8051 processor - the Dallas
DS89C420. Each processor runs at its top speed, executing a program that repeatedly calculates and
displays a Mandelbrot fractal image. The image colors change with each iteration.
The two images
share a single monitor, with the 3D-IC image on the upper half and the other processor's
image on the lower half.
Video:
The video was filmed during a live demonstration and then compressed to run six times faster
than realtime. The demonstration clearly shows the speed advantage of the
3D-IC, which
completes three full images while the other processor completes about half of one image.
